Artikelnummer: | CPIN256 |
Herstellernummer: | BX8071513700KF |
EAN Code: | 5032037258715 |
Versandgewicht: | 0.1 kg |
Produktinformationen
Hauptmerkmale
Zubehör
Service / Support
Hauptmerkmale |
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Produktbeschreibung: | Intel Core i7 13700KF / 3.4 GHz Prozessor - Box |
Produkttyp: | Prozessor |
Prozessortyp: | Intel Core i7 13700KF (13th Gen) |
Anz. der Kerne: | 16 Kerne / 24 Threads |
Cache-Speicher: | 30 MB |
Geeignete Sockel: | LGA1700 Socket |
Prozessoranz.: | 1 |
Taktfrequenz: | 3.4 GHz (P-Kern) / 2.5 GHz (E-Kern) |
Max. Turbo-Taktfrequenz: | 5.4 GHz (P-Kern) / 4.2 GHz (E-Kern) |
Herstellungsprozess: | 10 nm |
Funktionen: | Enhanced SpeedStep technology, Hyper-Threading-Technologie, Unterstützung für Execute Disable Bit, Intel Virtualization Technology, Intel 64 Technology, Streaming-SIMD-Erweiterungen 4.1, Streaming-SIMD-Erweiterungen 4.2, Intel Turbo Boost Technology 2.0, Intel AES New Instructions (AES-NI), Thermal Monitoring Technologies, Intel Virtualization Technology for Directed I/O (VT-d), Idle States, Intel VT-x with Extended Page Tables (EPT), Intel Secure Key, Intel Advanced Vector Extensions 2 (AVX2.0), Intel OS Guard, Intel Turbo Boost Max Technology 3.0, Intel Speed Shift Technology, Mode-based Execute Control (MBE), Intel Volume Management Device (VMD), Intel Boot Guard, Intel Deep Learning Boost (DL Boost), Intel Control-Flow Enforcement Technology, Intel Gaussian and Neural Accelerator 3.0, Intel Thread Director, Instruction Set 64-bit, Intel Standard Manageability (ISM) |
Allgemein |
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Hersteller: | Intel |
Herst.Art.Nr.: | BX8071513700KF |
EAN: | 5032037258715 |
Produkttyp: | Prozessor |
Prozessor | |
Typ / Formfaktor: | Intel Core i7 13700KF (13th Gen) |
Anz. der Kerne: | 16 Kerne |
Anz. der Threads: | 24 Threads |
Cache-Speicher: | 30 MB |
Cache-Speicher-Details: | Smart Cache - 30 MB |
Prozessoranz.: | 1 |
Taktfrequenz: | 3.4 GHz (P-Kern) / 2.5 GHz (E-Kern) |
Max. Turbo-Taktfrequenz: | 5.4 GHz (P-Kern) / 4.2 GHz (E-Kern) |
Geeignete Sockel: | LGA1700 Socket |
Herstellungsprozess: | 10 nm |
Thermal Design Power (TDP): | 253 W |
Temperaturspezifikationen: | 100 °C |
PCI Express Revision: | 4.0/5.0 |
PCI Express-Konfigurationen: | 1x16+4, 2x8+4 |
Anz. PCI Express Lanes: | 20 |
Architektur-Merkmale: | Enhanced SpeedStep technology, Hyper-Threading-Technologie, Unterstützung für Execute Disable Bit, Intel Virtualization Technology, Intel 64 Technology, Streaming-SIMD-Erweiterungen 4.1, Streaming-SIMD-Erweiterungen 4.2, Intel Turbo Boost Technology 2.0, Intel AES New Instructions (AES-NI), Thermal Monitoring Technologies, Intel Virtualization Technology for Directed I/O (VT-d), Idle States, Intel VT-x with Extended Page Tables (EPT), Intel Secure Key, Intel Advanced Vector Extensions 2 (AVX2.0), Intel OS Guard, Intel Turbo Boost Max Technology 3.0, Intel Speed Shift Technology, Mode-based Execute Control (MBE), Intel Volume Management Device (VMD), Intel Boot Guard, Intel Deep Learning Boost (DL Boost), Intel Control-Flow Enforcement Technology, Intel Gaussian and Neural Accelerator 3.0, Intel Thread Director, Instruction Set 64-bit, Intel Standard Manageability (ISM) |
Verschiedenes | |
Verpackung: | Intel Boxed |